A dual level loadlock facilitates two pallet operation. Pallets can be introduced into and removed from the system while maintaining process vacuum.
Substrates coated via single pass method exhibit superior film quality and step coverage by eliminating layer effect associated with multiple pass deposition.
RF Magnetron, RF Diode and DC Magnetron capability exists at each cathode/target position for sputtering or evaporation. The refurbished system can be configured to your requirements.
Assures that the source material arrives at the substrate possessing relatively uniform energy so that the physical, electrical and adhesion characteristics of the film are consistent.
In addition to accommodating standard 2 and 3 inch, 100, 125, and 150 mm wafers, substrates of up to 1.5 inches in height can be easily processed. Other heights are available upon special order.